Parker LORD Structural Adhesives, Thermal Management & Electronic Materials

Parker LORD develops engineered materials for structural bonding, thermal management, semiconductor and electronic assembly, surface preparation, and elastomer bonding. The portfolio includes LORD epoxy, structural acrylic, urethane, and specialty adhesive systems; COOLTHERM materials for thermal management and electronic packaging; and Chemlok materials for rubber-to-substrate bonding.

As an authorized Parker LORD distributor, Krayden supplies a selection of structural adhesives, COOLTHERM thermal-management and electronic materials, Chemlok bonding systems, and related surface-preparation products. Our team can help customers compare adhesive chemistry, substrates, bond or gap geometry, thermal requirements, dispensing methods, cure processes, electrical requirements, and other application-specific considerations.

Markets Served by Parker LORD

Aerospace & Defense Automotive & Transportation Electric Vehicles & Electrification Electronics & Semiconductors Industrial Manufacturing Energy Marine

Featured Parker LORD Brands

Key Parker LORD brands supporting structural bonding, thermal management, electronic packaging, and rubber-to-substrate bonding.

LORD

Structural adhesive systems spanning epoxy, structural acrylic, urethane, and specialty chemistries for engineered assembly. Product selection depends on substrates, bond geometry, cure and handling requirements, and the mechanical demands of the finished assembly.

COOLTHERM

Thermal-management and electronic materials including thermally conductive adhesives, gap fillers, gels, potting and encapsulation systems, die-attach materials, and semiconductor-package protection products.

Chemlok

Elastomer-bonding materials for rubber-to-metal and rubber-to-substrate applications, including systems used during molding and specialized bonding processes.

Parker LORD structural adhesive application

LORD Structural Bonding Systems

Structural Adhesives

Parker LORD structural adhesives include epoxy, structural acrylic, urethane, and specialty systems for joining metals, composites, plastics, and other engineered assemblies. Different chemistries address different combinations of cure speed, stiffness or flexibility, gap filling, impact and peel requirements, substrate preparation, and production method.

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Chemistry

Epoxy Adhesives

Two-component epoxy systems provide structural bonding options for metal, composite, plastic, and other engineered assemblies where controlled cure and durable attachment are required.

LORD 309-1D LORD 310

Chemistry

Structural Acrylic Adhesives

Structural acrylic adhesives support fast production bonding of metals, plastics, composites, and mixed-material assemblies where rapid handling, impact and peel performance, gap filling, or reduced surface preparation are important.

LORD 410 / Accelerator 19GB LORD 406E LORD MAXLOK MX/T3S

Chemistry

Urethane & Specialty Adhesives

Urethane and specialty adhesive systems provide alternatives for assemblies that benefit from flexibility, stress distribution, or bonding of engineered composites and plastics.

LORD 7542D LORD 7550

Parker LORD thermal management application

COOLTHERM Thermal Management Materials

Thermal Management Materials

COOLTHERM materials support thermal interfaces and component protection in EV batteries, power electronics, motors, semiconductor assemblies, and other heat-generating systems. The portfolio includes thermally conductive adhesives, dispensable gap fillers, gels, and potting or encapsulation systems.

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Thermal Function

Thermally Conductive Adhesives

Bonding materials that provide structural attachment while creating a conductive thermal pathway between heat-generating components and cooling structures.

COOLTHERM EP-6037

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Interface Format

Gap Fillers

Dispensable gap fillers conform to dimensional variation between heat-generating components and cooling surfaces to maintain a continuous thermal interface.

COOLTHERM SC-1600

Dispensable Thermal Interface

Thermally Conductive Gels

Thermally conductive gels provide a compliant dispensable interface for assemblies where low mechanical stress, dimensional variation, and thermal transfer are important.

COOLTHERM MG-121

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Protection Method

Potting & Encapsulation

Potting and encapsulation materials protect electrical and electronic components while supporting thermal, dielectric, environmental, and mechanical requirements.

COOLTHERM SC-309 COOLTHERM SC-6725

Chemlok Elastomer Bonding Systems

Rubber-to-Substrate Bonding

Chemlok bonding systems are used to bond rubber and other elastomers to metal and selected rigid substrates during molding, curing, and specialized post-vulcanization processes. Product selection depends on elastomer type, substrate, molding conditions, cure temperature, surface preparation, and required environmental resistance.

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Elastomer Bonding

Rubber-to-Metal & In-Mold Bonding

Chemlok products support molded rubber components where reliable adhesion to prepared metal or other rigid substrates must withstand mechanical, thermal, and environmental service conditions.

CHEMLOK 607

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Bond Preparation & Specialty Systems

Primers & Specialty Elastomer Bonding

Chemlok primers and specialized one-coat or multi-step systems extend elastomer bonding across different rubber compounds, urethanes, substrate combinations, and manufacturing processes.

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COOLTHERM Microelectronic Materials

Electronic Assembly & Semiconductor Packaging

Parker LORD electronic materials support semiconductor die attachment, package underfill, encapsulation, and related electronic assembly requirements. Selection depends on package architecture, thermal and electrical requirements, cure conditions, flow behavior, coefficient-of-thermal-expansion considerations, reliability targets, and manufacturing process.

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Semiconductor Assembly

Die Attach & Conductive Adhesives

Die-attach materials bond semiconductor devices to package structures while supporting thermal and mechanical requirements in processors, power devices, and other microelectronic assemblies.

COOLTHERM MD-140

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Package Protection

Underfills & Package Encapsulants

Underfill materials flow beneath semiconductor packages to reinforce solder interconnects and help manage mechanical stresses generated by thermal cycling, shock, vibration, and differences in thermal expansion.

COOLTHERM ME-525 COOLTHERM ME-531

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LORD Bond Preparation Materials

Surface Preparation Materials

Parker LORD surface-preparation materials include primers, accelerators, and adhesion promoters used with selected adhesive and elastomer-bonding processes. These products should be matched to the exact adhesive system, substrate condition, cleaning method, and production sequence.

Primers

Primers condition properly prepared substrates before selected adhesive or elastomer-bonding processes. The correct primer depends on substrate, adhesive chemistry, cleaning process, coating method, and drying requirements.

Accelerators

Accelerators are paired with specified LORD adhesive systems to initiate or influence cure behavior. Working time, production cycle, application sequence, and adhesive compatibility should be confirmed for the selected system.

Adhesion Promoters

Adhesion promoters and surface treatments improve receptivity of selected plastics, rubbers, and other difficult substrates when used with compatible bonding systems and the specified surface-preparation process.

Application Spotlight

EV Battery Packs

Parker LORD materials address several important interfaces within EV battery assemblies. LORD structural adhesives support bonded pack and module construction, while COOLTHERM materials provide options for thermal transfer, filling irregular interfaces, and potting or encapsulating selected components.

Thermal Heat-transfer materials

Bonding Structural adhesives

Interfaces Gap fillers & gels

Protection Potting & encapsulation

Explore the Application Page

Talk to our Experts

Krayden can help compare Parker LORD materials for structural bonding, thermal management, electronic assembly, elastomer bonding, surface preparation, and related manufacturing requirements. Our team can support product selection, substrate and application review, processing considerations, and comparison of candidate materials for your production needs.

Contact our team Call +1 (800) 448-0406

Parker LORD Quick Reference

Brands Carried

LORD, COOLTHERM, Chemlok

Core Technologies

Structural Bonding, Thermal Management, Electronic Packaging & Elastomer Bonding

Top Categories

Structural Adhesives, Thermal Management, Rubber-to-Substrate Bonding, Semiconductor Packaging

Key Markets

Aerospace & Defense, Transportation, EV & Electrification, Electronics & Semiconductors