COOLTHERM SC-6709/SC-6731
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 100:0.5 Weight Mixing
- 12 to 16 Hour Room-Temperature Cure
- 21.7 kV/mm Dielectric Strength
Product Description
CoolTherm SC-6709/SC-6731 Silicone Encapsulant System is a two-part, solvent-free RTV silicone system for potting and encapsulating electrical and electronic components. SC-6709 is a white resin with a typical viscosity of 32,000 cP at 25 deg C and mixes with SC-6731 hardener at 100:0.5 by weight. The mixed system has a typical gel time of 1 to 2 hours at 25 deg C and cures in 12 to 16 hours at 25 deg C. Typical cured properties include 1.0 W/(m K) thermal conductivity, 50 Shore A hardness, 2.14 MPa tensile strength, and 21.7 kV/mm dielectric strength.
Key features
- Resin-to-hardener mix ratio: SC-6709 resin and SC-6731 hardener combine at 100:0.5 by weight.
- Room-temperature cure: The mixed system typically cures in 12 to 16 hours at 25 deg C after a 1 to 2 hour gel time.
- Cured dielectric strength: Typical cured dielectric strength is 21.7 kV/mm.
Applications
Potting and encapsulation of electrical and electronic components using SC-6709 resin with SC-6731 hardener.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
SC-6709 resin and SC-6731 hardener are separate components; mixed-system data apply to the documented 100:0.5 by-weight combination.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance, SC-6709 resin | White liquid | Typical | |
| Viscosity, SC-6709 resin | 32,000 | cP | Typical; 25 deg C |
| Specific gravity, SC-6709 resin | 1.80 | Typical; 25 deg C | |
| Mix ratio, resin:hardener | 100:0.5 | by weight | SC-6709 resin with SC-6731 hardener |
| Gel time | 1 to 2 | h | Typical; SC-6709/SC-6731; 25 deg C |
Cured encapsulant properties
Cured properties are typical for the SC-6709 silicone system; the current TDS states they are the same regardless of the documented hardener used.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.0 | W/(m K) | Typical; Hot Disc Transient Method; ISO 22007-2 |
| Coefficient of linear thermal expansion | 50 | ppm/deg C | Typical |
| Hardness | 50 | Shore A | Typical |
| Tensile strength | 2.14 | MPa | Typical; 25 deg C |
| Elongation at break | 115 | % | Typical |
| Volume resistivity | 1 x 10^15 | ohm-cm | Typical; 25 deg C |
| Dielectric strength | 21.7 | kV/mm | Typical; ASTM D149 |