COOLTHERM SC-252

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

COOLTHERM SC-252

Main features

  • 2.5 W/(m K) Thermal Conductivity
  • 8.7 kV/mm Dielectric Strength
  • 1:1 Weight or Volume Mixing

Product Description

CoolTherm SC-252 Thermally Conductive Silicone Encapsulant is a two-part, gray silicone encapsulant for potting electrical and electronic components where thermal conductivity and electrical insulation are required. Resin and hardener mix 1:1 by weight or volume, and mixed viscosity is typically 18,000 cP at 25 deg C at a 10 s^-1 shear rate. Cure schedules are 24 hours at 25 deg C, 45 minutes at 85 deg C, or 30 minutes at 120 deg C. Typical cured thermal conductivity is 2.5 W/(m K) and dielectric strength is 8.7 kV/mm. The material also provides improved adhesion to aluminum without primer.

Key features

  • Cured thermal conductivity: Typical cured thermal conductivity is 2.5 W/(m K).
  • Cured dielectric strength: Typical cured dielectric strength is 8.7 kV/mm.
  • Equal-ratio mixing: Resin and hardener mix 1:1 by weight or volume.

Applications

Potting and encapsulation of electrical and electronic components where thermal conductivity and electrical insulation are required.

Product Family

COOLTHERM SC-252

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Resin (A): Gray Liquid | Hardener (B): White Liquid | Mixed: Gray Liquid
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
A/B/Mixed: 2.92/2.95/2.93
Physical Properties
Viscosity (Part A)
18,000 mPa.s
Viscosity (Part B)
17,000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.5 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
8.7 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
>1 x 10^14 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Resin and hardener are supplied separately; mixed values apply after the 1:1 combination.

PropertyValueUnitMethod / condition
Mix ratio, resin:hardener1:1by weight or volumeBefore application
Viscosity, resin18,000cPTypical; 25 deg C; 10 s^-1 shear rate
Viscosity, hardener17,000cPTypical; 25 deg C; 10 s^-1 shear rate
Viscosity, mixed18,000cPTypical; 25 deg C; 10 s^-1 shear rate
Specific gravity, mixed2.93Typical; mixed material
Working life45minTypical; mixed material; 25 deg C
Technical properties

Cured encapsulant properties

Typical cured values use a cure schedule of 60 minutes at 121 deg C.

PropertyValueUnitMethod / condition
Thermal conductivity2.5W/(m K)Typical; Hot Disc Transient Method; ISO 22007-2
Hardness60Shore ATypical; ASTM D2240
Tensile strength1MPaTypical
Volume resistivity>1 x 10^14ohm-cmTypical; ASTM D257; 25 deg C
Dielectric strength8.7kV/mmTypical; ASTM D149
Dielectric constant5Typical; ASTM D150; 25 deg C; 1 MHz

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