COOLTHERM 6027
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Fast Heat-Cure Processing
- Non-Sag Thixotropic Dispensing
- High-Resistivity Cured Insulation
Product Description
Circalok 6027 Epoxy Adhesive is a one-component, thixotropic epoxy formulated for surface-mount device and electronic component mounting. The yellow paste has a typical viscosity of 450,000 cP at 25 deg C and a specific gravity of 1.25. Its rheology is non-sag after dispensing, while heat cure can be completed in 30 minutes at 121 deg C or 10 minutes at 150 deg C once the adhesive reaches temperature. Typical cured data include volume resistivity above 1 x 10^14 ohm cm, Shore D 85 hardness, and dielectric strength above 400 V/mil, combining controlled dispensing with electrically insulating cured performance.
Key features
- Fast Heat Cure: Cures in 30 minutes at 121 deg C or 10 minutes at 150 deg C after the adhesive reaches temperature.
- Non-Sag Dispensing: Thixotropic rheology maintains the dispensed adhesive shape before cure.
- Electrical Insulation: Typical cured volume resistivity exceeds 1 x 10^14 ohm cm and dielectric strength exceeds 400 V/mil.
Applications
Surface-mount device and electronic component mounting.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Thermal Properties
Additional Information
As-Supplied Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Yellow paste | Typical; uncured | |
| Viscosity | 450,000 | cP | Typical; uncured; 25 deg C |
| Specific gravity | 1.25 | Typical; uncured |
Final-State Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Volume resistivity | >1 x 10^14 | ohm cm | Typical; cured; 25 deg C |
| Glass transition temperature (Tg) | 90 | deg C | Typical; cured; TMA |
| Hardness | 85 | Shore D | Typical; cured; 25 deg C |
| Tensile strength | >11 | MPa | Typical; cured; AL-AL |
| Dielectric strength | >400 | V/mil | Typical; cured |