LOCTITE MP 200

LOCTITE MP 200 is a no-clean Sn/Pb solder paste formulated for high-speed stencil printing and reflow soldering in both air and nitrogen environments. Available in Sn62, Sn63, and 63S4 anti-tombstoning alloy options, it is designed for fine-pitch printing applications up to 0.4 mm pitch and printing speeds up to 200 mm/s. The paste provides extended open time, long tack life, resistance to hot and cold slump, and colorless residues that can remain on assemblies after reflow. Its soft residue characteristics can simplify post-process pin testing, while the ROL0 halide-free flux system supports reliable no-clean processing.

Key features

• High-speed fine-pitch printing: Suitable for stencil printing down to 0.4 mm pitch and printing speeds up to 200 mm/s.
• Extended process window: Provides long open time, extended tack life, and abandon time to support production flexibility.
• No-clean ROL0 formulation: Produces colorless, soft residues and meets ANSI/J-STD-004 ROL0 halide-free classification requirements.

Applications / Suitable for

• Fine-pitch SMT assembly
• High-speed stencil printing processes
• Reflow soldering in air or nitrogen atmospheres
• Electronics manufacturing requiring no-clean solder paste
• Applications where tombstoning reduction is desired using 63S4 alloy