LOCTITE D124F
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- No-Mix One-Component Processing
- Heat-Cure SMT Bonding
- Multi-Component SMT Assembly Fit
Product Description
LOCTITE D 124 F is a one-component yellow epoxy paste for heat-cure bonding of electronic components in surface-mount assembly. The adhesive is supplied as a single component and does not require separate resin and hardener mixing before application. It is intended for bonding surface-mount chip capacitors and resistors, as well as SOT, SOIC and PLCC packages. The paste form supports controlled placement at the component bonding area before the adhesive is thermally cured.
Key features
- No-Mix Application: Supplied as a single adhesive component, avoiding separate resin and hardener mixing.
- Thermally Cured SMT Bonding: Yellow epoxy paste for surface-mount electronics assembly.
- Chip and Package Bonding: Used for chip capacitors, resistors, SOT, SOIC and PLCC components.
Applications
Bonding chip capacitors, resistors, SOT, SOIC and PLCC components in surface-mount assembly.
