LOCTITE 3876

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LOCTITE 3876

Main features

  • Primer-Free Room-Temperature Cure
  • Fast 3 to 5 Minute Fixture
  • Structural Thermal Heat-Sink Bonding

Product Description

LOCTITE 3876 is a two-component, room-temperature-curing acrylate adhesive for thermally coupling and structurally bonding heat sinks to heat-dissipating electronic components. Pale-yellow Part A and pale-blue Part B cure when they contact, without primer or heat. The bead-on-bead system contains 175 um spacer beads for controlled bondline thickness, reaches fixture in 3 to 5 minutes at 23 deg C, and develops 1.76 W/(m K) thermal conductivity after cure. Applications include transistors, rectifiers, power devices, memory chips, chipsets, and graphics processors.

Key features

  • Primer-Free Contact Cure: Part A and Part B cure on contact without primer or heat.
  • Fast 3 to 5 Minute Fixture: Fixture time is 3 to 5 minutes at 23 deg C.
  • Structural Thermal Attachment: Cured thermal conductivity is 1.76 W/(m K) with structural bonding.

Applications

Applications include attaching transistors, rectifiers, power devices, memory devices, chipsets, and graphics processors to heat sinks.

Product Family

LOCTITE 3876

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two (A | B)
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.7
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
28 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.76 W/m.K
Other Properties
Storage Temperature
5 to 10 °C

Additional Information

Technical properties

As-Supplied Properties

Part A and Part B properties are shown separately.

PropertyValueUnitMethod / condition
Part A appearancePale yellow-As supplied
Part B appearancePale blue-As supplied
Part A specific gravity1.7-As supplied
Part B specific gravity1.7-As supplied
Part A viscosity65,000mPa s2.5 rpm
Part A viscosity32,000mPa s20 rpm
Part B viscosity190,000mPa s2.5 rpm
Part B viscosity90,000mPa s20 rpm
Technical properties

Final-State Properties

PropertyValueUnitMethod / condition
Coefficient of thermal expansion, alpha 154ppm/deg CCured material
Coefficient of thermal expansion, alpha 2141ppm/deg CCured material
Glass transition temperature28deg CCured material
Thermal conductivity1.76W/(m K)ASTM D 5470
Tensile shear strength16N/mm^2Grit-blasted steel
Tensile shear strength13N/mm^2Aluminum

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