LOCTITE 3629C

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE 3629C

Main features

  • Halogen-Free SMD Bonding
  • Controlled High-Speed Dotting
  • 90-Second Bondline Heat Cure

Product Description

LOCTITE 3629C uses a halogen-free, one-part red epoxy formulation for bonding SMD components to printed circuit boards before wave soldering. Its rheology is formulated to maintain controlled dot size and shape during high-speed dispensing. Recommended heat cure is at least 150 seconds at 120 deg C or 90 seconds at 150 deg C, measured at the bondline. The uncured adhesive has a seven-day pot life at 25 deg C, while the cured material reaches a glass transition temperature of at least 118 deg C after 30 minutes at 150 deg C. Applications include high-speed SMD dot dispensing before wave soldering.

Key features

  • Halogen-Free Formulation: The one-part epoxy formulation is identified as halogen free.
  • Controlled High-Speed Dotting: The rheology maintains controlled dot size and shape during high-speed dispensing.
  • Fast Bondline Cure: Recommended cure is 90 seconds at 150 deg C or at least 150 seconds at 120 deg C at the bondline.

Applications

High-speed dispensing of controlled adhesive dots for SMD-to-PCB bonding before wave soldering.

Product Family

LOCTITE 3629C

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Red
Density (g)
1.4 g/cm3
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
7 days
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.38
Other Properties
Storage Temperature
2 °C to 8 °C
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
≥118 °C

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
AppearanceRedAs supplied
Specific gravity1.38DimensionlessAs supplied
Yield point165Pa sHaake PK 100, M10/PK1, 2 deg cone; Casson model over 0.4 to 30 s^-1; 25 deg C
Pot life7days25 deg C
Recommended heat cure150 seconds at 120 deg C or 90 seconds at 150 deg CAt the bondline
On-machine lifeMaximum 2days25 deg C and 55% RH; continuous operation
Technical properties

After-processing / final-state properties

Cured-material values retain the listed thermal-analysis method and cure condition where available.

PropertyValueUnitMethod / condition
Thermal expansion coefficient below Tg45ppm/deg CISO 11359-1; typical
Thermal expansion coefficient above Tg144ppm/deg CISO 11359-1; typical
Glass transition temperatureAt least 118deg CTMA; sample cured 30 minutes at 150 deg C
Density1.4g/cm^325 deg C; cured material
DSC onset82deg CTypical cured-material thermal analysis
DSC peak120deg CTypical cured-material thermal analysis

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