LAIRD TPLI240
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Compliant 0.040-Inch Gap Filling
- 6.0 W/(m K) Thermal Path
- Configurable Adhesive Interface Formats
Product Description
Tpli 240 is a compliant 0.040 in (1.02 mm) boron nitride-filled silicone thermal gap filler in Laird's Tpli 200 family. Typical thermal conductivity is 6.0 W/(m K), with Shore 00 hardness of 70 and density of 1.4 g/cc. Typical volume resistivity is 5 x 10^13 ohm cm, providing an electrically insulating interface material. The grade can be configured without adhesive or with adhesive on one side, and sheet dimensions vary by part number. Its family temperature range is -45 to 200 deg C for electronics thermal interfaces.
Key features
- Mid-range thickness: The Tpli 240 grade is 0.040 in (1.02 mm) thick.
- Compliant thermal filling: Shore 00 hardness is typically 70.
- Electrical insulation: Typical volume resistivity is 5 x 10^13 ohm cm by ASTM D257.
Applications
Applications include automotive electronics, drones and satellites, gaming systems, instrumentation, notebooks and tablets, routers, and smart-home devices.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Grade thickness is product-specific; remaining values are typical for the Tpli 200 family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Grade thickness | 0.040 | in | 1.02 mm; configuration varies by part number |
| Thermal conductivity | 6.0 | W/(m K) | Typical; ASTM D5470 |
| Density | 1.4 | g/cc | Typical; helium pycnometer |
| Hardness | 70 | Shore 00 | Typical; ASTM D2240 |
| Volume resistivity | 5 x 10^13 | ohm cm | Typical; ASTM D257 |
| Temperature range | -45 to 200 | deg C | Tpli 200 family range |