LAIRD TFLEX SF890

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LAIRD TFLEX SF890

Main features

  • 7.8 W/(m K) Thermal Conductivity
  • Non-Silicone Thermal Interface
  • 90 Mil Wide-Gap Coverage

Product Description

Tflex SF890 is the 0.090 in (2.25 mm) grade in Laird's Tflex SF800 non-silicone gap-filler series. The grey, ceramic-filled sheet provides 7.8 W/(m K) thermal conductivity for silicone-sensitive thermal interfaces and is naturally tacky on both sides for placement without a separate adhesive layer. Shore 00 hardness of 81 and published pressure-based thermal-resistance data support design screening for installed interface behavior. The exact grade operates from -20 to 120 deg C and includes dielectric, volume-resistivity, and UL 94 V-0 data. Its preformed format supports controlled thickness across wider electronic gaps.

Key features

  • 7.8 W/(m K) performance: Provides measured thermal conductivity for demanding interfaces.
  • Non-silicone formulation: Supports thermal design in silicone-sensitive electronics.
  • 90 mil wide-gap pad: Nominal 0.090 in thickness bridges larger interface gaps.

Applications

Automotive ADAS; Automotive Electronics; Automotive Infotainment; Automotive Powertrain/ECUs; Drones/Satellites; Gaming Systems; Instrumentation; Notebooks/Tablets/Portable Devices; Routers; Smart Home Devices; Solid State Drives; Wireless infrastructure

Technical Specifications

General Properties
Color
Grey
Density (g)
3.21 g/cm3
Thermal Properties
Temperature Range
-25°C to 120 °C
Thermal Conductivity
7.8 W/m.K
Electrical Properties
Volume Resistivity
5x10¹² Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
ConstructionCeramic-filled non-silicone sheetLaird Tflex SF800 datasheet
Nominal thickness2.25 (0.090)mm (in)Exact Tflex SF890 part page
ColorGreyVisual
Density3.20g/ccExact Tflex SF890 part page
Hardness81Shore 00ASTM D2240
SurfaceNaturally tacky on both sidesExact product family
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
Thermal conductivity7.8W/(m K)ASTM D5470
Operating temperature range-20 to 120deg CExact Tflex SF890 part page
Thermal resistance0.237deg C in^2/W40 mil test thickness; 10 psi; modified ASTM D5470
Dielectric constant15.90Exact Tflex SF890 part page
Volume resistivity5 x 10^12ohm-cmASTM D257
UL flammability ratingV-0UL 94

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