LAIRD TFLEX HR640
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Pressure-Qualified Thermal Resistance
- High-Recovery Gap Conformability
- 40 Mil Controlled Thickness
Product Description
Tflex HR640 is the 0.040 in (1.02 mm) grade in Laird's Tflex HR600 high-recovery silicone gap-filler series. The dark grey, ceramic-filled sheet combines 3.0 W/(m K) thermal conductivity with soft compression behavior for uneven thermal interfaces. At 10 psi, the grade reports 14% deflection and 0.45 deg C in^2/W thermal resistance, giving designers pressure-specific data for interface selection. The pad is naturally tacky, handles as a preformed sheet, and operates from -45 to 200 deg C. Electrical resistivity and UL 94 V-0 data support screening for electrically isolating electronics assemblies.
Key features
- Pressure-specific performance: Reports 0.45 deg C in^2/W thermal resistance at 10 psi.
- High-recovery sheet: Conforms under load and recovers toward its original thickness.
- 40 mil gap coverage: Nominal 0.040 in thickness supports controlled interface spacing.
Applications
Automotive ADAS; Automotive Electronics; Automotive Infotainment; Automotive Powertrain/ECUs; Drones/Satellites; Gaming Systems; Instrumentation; Notebooks/Tablets/Portable Devices; Routers; Smart Home Devices; Wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled silicone sheet | Laird Tflex HR600 datasheet | |
| Nominal thickness | 1.02 (0.040) | mm (in) | Exact Tflex HR640 part page |
| Color | Dark grey | Visual | |
| Density | 2.50 | g/cc | Helium pycnometer |
| Hardness | 40 | Shore 00 | ASTM D2240 |
| Outgassing | TML 0.19; CVCM 0.07 | % | ASTM E595 |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.0 | W/(m K) | ASTM D5470 |
| Thermal resistance | 0.45 | deg C in^2/W | 10 psi; exact grade |
| Thermal resistance | 0.36 | deg C in^2/W | 30 psi; exact grade |
| Thermal resistance | 0.31 | deg C in^2/W | 50 psi; exact grade |
| Operating temperature range | -45 to 200 | deg C | Laird test |
| Dielectric constant | 19 | 1 MHz; ASTM D150 | |
| Volume resistivity | 1 x 10^13 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
