LAIRD TFLEX HR630
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- High-Recovery Gap Conformability
- 3.0 W/(m K) Thermal Conductivity
- 30 Mil Controlled Thickness
Product Description
Tflex HR630 is a 0.030 in (0.75 mm) high-recovery silicone gap filler designed to bridge uneven component-to-heat-sink interfaces. Its 3.0 W/(m K) thermal conductivity supports heat transfer while the soft, recoverable sheet conforms under pressure and returns toward its original thickness when load is released. The dark grey ceramic-filled material is naturally tacky and supplied as a preformed pad for placement without dispensing. A -45 to 200 deg C temperature range supports demanding electronics environments, while dielectric and UL 94 V-0 data help engineers screen the material for electrically isolating thermal interface designs.
Key features
- High-recovery conformability: Soft silicone sheet conforms to uneven gaps and recovers after compression.
- 3.0 W/(m K) performance: Provides measured thermal conductivity for heat-transfer interface design.
- 30 mil preformed pad: Nominal 0.030 in thickness supports controlled gap filling.
Applications
Automotive ADAS; Automotive Electronics; Automotive Infotainment; Automotive Powertrain/ECUs; Drones/Satellites; Gaming Systems; Instrumentation; Notebooks/Tablets/Portable Devices; Routers; Smart Home Devices; Wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled silicone sheet | Laird Tflex HR600 datasheet | |
| Nominal thickness | 0.75 (0.030) | mm (in) | Tflex HR630 grade |
| Color | Dark grey | Visual | |
| Density | 2.50 | g/cc | Helium pycnometer |
| Hardness | 40 | Shore 00 | ASTM D2240 |
| Outgassing | TML 0.19; CVCM 0.07 | % | ASTM E595 |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.0 | W/(m K) | ASTM D5470 |
| Operating temperature range | -45 to 200 | deg C | Laird test |
| Dielectric constant | 19 | 1 MHz; ASTM D150 | |
| Volume resistivity | 1 x 10^13 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
