LAIRD TFLEX HR460
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Low-Modulus Interface Conformance
- High-Recovery Reassembly Performance
- Naturally Tacky Placement Control
Product Description
Tflex HR460 is a dark-grey, ceramic-filled silicone thermal gap-filler sheet from the Tflex HR400 series, defined at a nominal 0.060 in thickness. The low-modulus pad conforms to component topography with little stress on components and mating parts. Natural tack holds the pad during assembly and transport without an additional adhesive coating, while high recovery preserves mechanical integrity through device rework and reassembly. Typical HR400 properties include 1.8 W/(m K) thermal conductivity, Shore 00 hardness of 53, and a -50 to 160 deg C temperature range. The 60 mil grade combines placement control with rework-oriented interface performance.
Key features
- Low-modulus conformance: Follows component topography with little stress on mating parts.
- High-recovery interface: Retains mechanical integrity through device rework and reassembly.
- Naturally tacky placement: Holds position during assembly and transport without added adhesive.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness; remaining values are typical for the Tflex HR400 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 0.060 | in | Part-number convention |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Dark grey | Visual | |
| Density | 1.93 | g/cm^3 | Helium pycnometer |
| Hardness | 53 | Shore 00 | ASTM D2240 |
| Surface tack | Tacky on both sides | As supplied |
Installed Interface Properties
Typical Tflex HR400 material-family properties; thermal resistance is measured at 40 mil and 10 psi.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.8 | W/(m K) | ASTM D5470 |
| Thermal resistance | 1.00 | deg C in^2/W | ASTM D5470 (modified); 40 mil, 10 psi |
| Temperature range | -50 to 160 | deg C | Laird test method |
| Dielectric constant | 4.81 | ASTM D150; 1 MHz | |
| Volume resistivity | 2 x 10^13 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
