LAIRD TFLEX HD91500
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- High-Conductivity Gap Bridging
- Low-Pressure Surface Conformance
- 1500-um Thickness Availability
Product Description
Tflex HD91500 provides the Tflex HD90000 high-deflection material in a 9 x 9 in sheet at a nominal 1500 um (0.060 in) thickness. Its grey ceramic-filled silicone construction combines 7.5 W/(m K) thermal conductivity with low pressure-versus-deflection performance. Surface wetting reduces contact resistance and mechanical stress at the interface. The material has Shore 00 hardness of 32 for thicknesses of 1000 um and above, plus 0.17% TML and 0.01% CVCM outgassing values by ASTM E595. The 60 mil grade applies to automotive electronics, drones and satellites, instrumentation, portable devices, routers, and smart-home equipment.
Key features
- 1500 um thermal sheet: Supplies a nominal 0.060 in grade in a 9 x 9 in format.
- High-deflection interface: Conforms at low pressure to reduce component stress.
- Controlled outgassing: Combines low TML and CVCM values with 7.5 W/(m K) conductivity.
Applications
Automotive ADAS; automotive electronics; automotive infotainment; automotive powertrain/ECUs; drones and satellites; gaming systems; instrumentation; notebooks, tablets, and portable devices; routers; smart-home devices; wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness and sheet size; remaining values are typical for the Tflex HD90000 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 1500 | um | Part-number convention; 0.060 in |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Grey | Visual | |
| Density | 3.5 | g/cm^3 | Helium pycnometer |
| Hardness | 32 | Shore 00 | ASTM D2240 |
| Sheet size | 9 x 9 | in | Exact grade format |
Installed Interface Properties
Typical Tflex HD90000 material-family properties; thermal resistance is measured at 40 mil, 10 psi, and 50 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 7.5 | W/(m K) | Hot Disk |
| Thermal resistance | 0.198 | deg C in^2/W | ASTM D5470; 40 mil, 10 psi, 50 deg C |
| Temperature range | -65 to 125 | deg C | Laird test method |
| Dielectric constant | 8.14 | ASTM D150; 1 MHz | |
| Volume resistivity | 8.73 x 10^13 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
