LAIRD TFLEX HD740
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Surface-Wetting Contact Performance
- Low-Resistance Thermal Interface
- 0.040-Inch Thickness Selection
Product Description
Tflex HD740 brings the 5.0 W/(m K) Tflex HD700 material to a nominal 0.040 in thermal gap-filler sheet. Its high-deflection silicone construction wets interface surfaces and compresses with low pressure, reducing contact resistance and component stress while maintaining the conductive thermal path. The pink sheet has a +/-10% thickness tolerance, a 3.3 g/cm^3 density, Shore 00 hardness of 54, and a -50 to 200 deg C temperature range. The 40 mil grade is relevant to automotive electronics, drones and satellites, gaming systems, instrumentation, portable devices, routers, and smart-home equipment.
Key features
- 40 mil interface grade: Provides a nominal 0.040 in thermal gap-filler thickness.
- Surface-wetting contact: Reduces contact resistance across mating surfaces.
- Low-pressure heat transfer: Combines compliant deflection with 5.0 W/(m K) conductivity.
Applications
Automotive ADAS; automotive electronics; automotive infotainment; automotive powertrain/ECUs; drones and satellites; gaming systems; instrumentation; notebooks, tablets, and portable devices; routers; smart-home devices; wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness; remaining values are typical for the Tflex HD700 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 0.040 | in | Part-number convention |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Pink | Visual | |
| Density | 3.3 | g/cm^3 | Helium pycnometer |
| Hardness | 54 | Shore 00 | ASTM D2240 |
Installed Interface Properties
Typical Tflex HD700 material-family properties; thermal resistance is measured at 40 mil and 10 psi.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 5.0 | W/(m K) | ASTM D5470 |
| Thermal resistance | 0.287 | deg C in^2/W | ASTM D5470 (modified); 40 mil, 10 psi |
| Temperature range | -50 to 200 | deg C | Laird test method |
| Dielectric constant | 5.01 | ASTM D150; 1 MHz | |
| Volume resistivity | 1.4 x 10^14 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
