LAIRD TFLEX HD360
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Low-Pressure Variable-Gap Conformance
- 2.7 W/(m K) Thermal Transfer
- 0.060-Inch Thickness Control
Product Description
Tflex HD360 is a pink, ceramic-filled silicone thermal gap-filler sheet in the Tflex HD300 series, with a nominal 0.060 in thickness. Its 2.7 W/(m K) thermal conductivity combines with high-deflection behavior and surface wetting to lower contact resistance across variable gaps while limiting stress on boards and components. The material carries a +/-10% thickness tolerance, a Shore 00 hardness of 38, and a -40 to 200 deg C temperature range. This thickness grade is suited to thermal interfaces in automotive electronics, instrumentation, portable devices, routers, smart-home equipment, and wireless infrastructure.
Key features
- 0.060 in grade: Targets a 60 mil thermal gap-filler thickness.
- Low-pressure deflection: Conforms across variable gaps while minimizing board and component stress.
- Surface-wetting thermal path: Lowers contact resistance with 2.7 W/(m K) thermal conductivity.
Applications
Automotive ADAS; automotive electronics; automotive infotainment; automotive powertrain/ECUs; drones and satellites; gaming systems; instrumentation; notebooks, tablets, and portable devices; routers; smart-home devices; wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness; remaining values are typical for the Tflex HD300 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 0.060 | in | Part-number convention |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Pink | Visual | |
| Density | 3.1 | g/cm^3 | Helium pycnometer |
| Hardness | 38 | Shore 00 | ASTM D2240 |
Installed Interface Properties
Typical Tflex HD300 material-family properties; thermal resistance is measured at 40 mil and 10 psi.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 2.7 | W/(m K) | ASTM D5470 |
| Thermal resistance | 0.573 | deg C in^2/W | ASTM D5470 (modified); 40 mil, 10 psi |
| Temperature range | -40 to 200 | deg C | Laird test method |
| Dielectric constant | 6.62 | ASTM D150; 1 MHz | |
| Volume resistivity | 1.2 x 10^14 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
