LAIRD TFLEX B260
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.060-Inch Preformed Gap Control
- Compliant Low-Modulus Gap Filling
- Reinforced Handling Options
Product Description
Tflex B260 uses a 0.060 in nominal thickness in the Tflex B200 family of ceramic-filled silicone thermal gap fillers. Its compliant, low-modulus interface conforms to application surfaces and carries heat with typical 2.0 W/(m K) thermal conductivity. Natural tack on both sides holds the gray pad during assembly without an added adhesive coating. The family includes standard, center-fiberglass MFG, and one-side FG constructions for different reinforcement and handling needs. Tflex B260 has typical Shore 00 hardness of 42, volume resistivity of 2 x 10^13 ohm cm, and a -40 to 150 deg C temperature range.
Key features
- 60-mil B200 grade: 0.060 in nominal Tflex B200 sheet.
- Low-modulus conformance: Compliant construction follows application surfaces.
- Construction options: Standard, center-fiberglass MFG, and one-side FG formats address different handling needs.
Applications
Applications include automotive powertrain and ECUs, drones and satellites, gaming systems, smart home devices, and notebooks, tablets, and other portable devices.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied properties
Typical Tflex B200 family data for the Tflex B260 thickness grade.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Ceramic-filled silicone sheet | - | Typical family construction |
| Nominal thickness | 0.060 | in | Tflex B260 grade |
| Color | Gray | - | Visual |
| Density | 2.2 | g/cm^3 | Typical; helium pycnometer |
| Hardness | 42 | Shore 00 | Typical; ASTM D2240, 3-second reading |
Installed / in-service properties
Typical Tflex B200 family data for the Tflex B260 thickness grade. Thermal resistance is measured at 1.0 mm, not the nominal grade thickness.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 2.0 | W/(m K) | Typical; ASTM D5470 |
| Thermal resistance | 1.10 | deg C in^2/W | ASTM D5470; 1.0 mm, 10 psi, 50 deg C |
| Temperature range | -40 to 150 | deg C | Laird test method |
| Volume resistivity | 2 x 10^13 | ohm cm | Typical; ASTM D257 |
| Flammability rating | V-0 | - | UL 94 |
