LAIRD TFLEX B2120

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LAIRD TFLEX B2120

Main features

  • 0.120-Inch Preformed Gap Control
  • Compliant Low-Modulus Interface
  • 2 W/(m K) Interface Heat Transfer

Product Description

Tflex B2120 is a 0.120 in ceramic-filled silicone thermal gap-filler sheet in the Tflex B200 family. Its low-modulus, compliant construction conforms to application surfaces, while typical 2.0 W/(m K) thermal conductivity transfers heat across the interface. The gray pad is naturally tacky on both sides for placement during assembly. Standard, center-fiberglass MFG, and one-side FG constructions are available within the family for different handling and reinforcement requirements. The material also has typical volume resistivity of 2 x 10^13 ohm cm and a -40 to 150 deg C temperature range.

Key features

  • 120-mil sheet: 0.120 in preformed Tflex B200 grade.
  • Compliant interface: Low-modulus construction conforms to application surfaces.
  • Dual-side tack: Natural tack on both sides supports placement during assembly.

Applications

Applications include automotive electronics, gaming systems, instrumentation, routers, wireless infrastructure, and portable devices.

Technical Specifications

General Properties
Color
Grey
Density (g)
2.2 g/cm3
Thickness range
1 - 5 mm
Thermal Properties
Temperature Range
-400C to 150 °C
Thermal Conductivity
2.0 W/m.K
Electrical Properties
Volume Resistivity
2 x 10¹³ Ohms⋅cm

Additional Information

Technical properties

As-supplied properties

Typical Tflex B200 family data for the Tflex B2120 thickness grade.

PropertyValueUnitMethod / condition
ConstructionCeramic-filled silicone sheet-Typical family construction
Nominal thickness0.120inTflex B2120 grade
ColorGray-Visual
Density2.2g/cm^3Typical; helium pycnometer
Hardness42Shore 00Typical; ASTM D2240, 3-second reading
Technical properties

Installed / in-service properties

Typical Tflex B200 family data for the Tflex B2120 thickness grade. Thermal resistance is measured at 1.0 mm, not the nominal grade thickness.

PropertyValueUnitMethod / condition
Thermal conductivity2.0W/(m K)Typical; ASTM D5470
Thermal resistance1.10deg C in^2/WASTM D5470; 1.0 mm, 10 psi, 50 deg C
Temperature range-40 to 150deg CLaird test method
Volume resistivity2 x 10^13ohm cmTypical; ASTM D257
Flammability ratingV-0-UL 94

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