LAIRD TFLEX 650
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.050-Inch Gap-Filler Format
- 3.0 W/(m K) Thermal Transfer
- Compliant Adhesive-Free Interface Placement
Product Description
Tflex 650 combines a nominal 0.050 in format with the ceramic-filled silicone construction of the Tflex 600 gap-filler family. The sheet has typical 3.0 W/(m K) thermal conductivity, Shore 00 hardness of 51, and volume resistivity of 2 x 10^13 ohm cm. High compliance allows low-stress interface contact, while natural tack avoids an added adhesive coating during placement. The material is electrically insulating and has a -45 to 200 deg C temperature range. It fits automotive electronics, drones and satellites, gaming systems, instrumentation, notebooks and tablets, routers, smart-home devices, and wireless infrastructure.
Key features
- 0.050 in sheet thickness: The Tflex 650 grade defines a nominal 0.050 in format.
- Thermal gap transfer: Typical thermal conductivity is 3.0 W/(m K) by ASTM D5470.
- Low-stress placement: High compliance and natural tack provide contact without an added adhesive coating.
Applications
Automotive ADAS; automotive electronics; drones and satellites; gaming systems; instrumentation; notebooks, tablets, and portable devices; wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Tflex 650 is the nominal 0.050 in Tflex 600 grade; other values are typical for Tflex 600 material.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction and composition | Ceramic-filled silicone sheet | - | As supplied |
| Color | Blue-violet | - | Visual; typical |
| Nominal thickness | 0.050 | in | Grade code; thickness in mils |
| Hardness | 51 | Shore 00 | ASTM D2240; typical |
| Surface tack | Naturally tacky on both sides | - | Standard construction; DC option changes tack configuration |
| Reinforcement | Not required | - | Thicknesses of 0.040 in and above |
After-processing / final-state properties
Typical Tflex 600 material data; thermal conductivity is a bulk value, not complete installed-interface performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.0 | W/(m K) | ASTM D5470; typical |
| Temperature range | -45 to 200 | deg C | Typical |
| Volume resistivity | 2 x 10^13 | ohm cm | ASTM D257; typical |
| Outgassing TML | 0.65 | % | ASTM E595; typical |
| Outgassing CVCM | 0.21 | % | ASTM E595; typical |
