LAIRD TFLEX 540
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.040-Inch Gap-Filler Format
- 2.8 W/(m K) Thermal Transfer
- Compliant Low-Pressure Interface Contact
Product Description
Tflex 540 is a filled-silicone elastomer thermal gap-filler sheet with a nominal 0.040 in thickness in the Tflex 500 series. Preliminary typical data include 2.8 W/(m K) thermal conductivity, a Shore 00 hardness of 40, and a light-blue appearance. The compliant sheet conforms at minimal pressure and is naturally tacky, so placement does not require an added adhesive coating. It remains electrically insulating and uses a silicone-and-filler construction with low silicone extractables. The format fits thermal interfaces in power electronics, servers, communications hardware, industrial automation equipment, and wireless infrastructure.
Key features
- 0.040 in thickness: The grade code identifies a nominal 0.040 in Tflex 500 sheet.
- 2.8 W/(m K) conductivity: Preliminary typical thermal conductivity is 2.8 W/(m K) by ASTM D5470.
- Compliant low-pressure contact: The soft sheet conforms with minimal pressure and is naturally tacky for assembly.
Applications
Cooling components to chassis; power electronics; computer servers; graphics cards; industrial automation equipment; wireless infrastructure; automotive engine control.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Tflex 540 is the nominal 0.040 in Tflex 500 grade; other values are preliminary typical data for Tflex 500 material.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Filled silicone elastomer | - | As supplied |
| Color | Light blue | - | Visual; preliminary typical |
| Nominal thickness | 0.040 | in | Grade code; thickness in mils |
| Thickness tolerance | +/-10 | % | Standard thicknesses |
| Density | 3.0 | g/cm^3 | Helium pycnometer; preliminary typical |
| Hardness | 40 | Shore 00 | ASTM D2240; 3-second delay; preliminary typical |
After-processing / final-state properties
Preliminary typical material properties for the Tflex 500 family; thermal conductivity is a bulk value, not complete installed-interface performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 2.8 | W/(m K) | ASTM D5470; preliminary typical |
| Temperature range | -50 to 200 | deg C | Preliminary typical |
| Volume resistivity | 10^13 | ohm cm | ASTM D257; preliminary typical |
| Outgassing TML | 0.29 | % | ASTM E595; preliminary typical |
| Outgassing CVCM | 0.04 | % | ASTM E595; preliminary typical |
| Coefficient of thermal expansion | 37.4 | ppm/deg C | IPC-TM-650 2.4.24; 70 to 130 deg C; preliminary typical |
