LAIRD TFLEX 3180TG
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Cut-Through-Resistant Dielectric Barrier
- Mass-Production Handling Support
- Compliant 4.57 mm Gap Filling
Product Description
Tflex 3180TG is a 4.57 mm Tgard-reinforced silicone thermal gap-filler sheet for electronic interfaces that require compliant heat transfer and an integral dielectric barrier. The light-green material has 1.2 W/(m K) thermal conductivity, 27 Shore 00 hardness and a +/-10% thickness tolerance. Its cut-through-resistant Tgard liner improves handling for mass production, while low compression set allows repeated use. The grade operates from -40 to 160 deg C. The surface is adhesive on one side for placement.
Key features
- Tgard reinforcement: Provides a cut-through-resistant dielectric barrier.
- 4.57 mm thickness: Combines grade-specific thickness with a +/-10% tolerance.
- Compliant heat transfer: Pairs 1.2 W/(m K) conductivity with 27 Shore 00 hardness.
Applications
Applications include notebook and desktop computers, telecom hardware, flat panels, memory modules, power conversion, automotive electronics and LED lighting.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values describe the supplied preformed sheet before installation.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Filled silicone elastomer on carrier liner | Typical | |
| Reinforcement carrier | Tgard | Exact family construction | |
| Color | Light green | Visual | |
| Nominal thickness | 4.57 | mm | Exact grade |
| Thickness tolerance | +/-10 | % | Typical |
| Specific gravity | 1.79 | ASTM D792 | |
| Hardness | 27 | Shore 00 | ASTM D2240 |
| Shelf life | 2 | years | From date of shipment |
After-processing / final-state properties
Values describe bulk or compressed material under the stated test conditions, not complete assembly performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.2 | W/(m K) | ASTM D5470; typical |
| Thermal resistance | 1.59 | deg C in^2/W | At 10 psi; ASTM D5470 modified |
| Coefficient of thermal expansion | 600 | ppm/deg C | IPC-TM-650 2.4.24 |
| Operating temperature | -40 to 160 | deg C | Typical range |
| Breakdown voltage | More than 10,000 | VAC | ASTM D149 |
| Flammability rating | 94V0 | UL |
