EPOXYLITE E230
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low-Temperature Trickle Impregnation
- 15 to 25 Minute Gel Time
- 1,700 Volts/Mil Dielectric Strength
Product Description
EPOXYLITE E230 is a two-component, low-temperature-curing, 100%-solids epoxy impregnating-resin system used with EPOXYLITE C230 hardener. The components mix at 100:20 by weight or 100:22.6 by volume. At 25 deg C, the mixed resin has typical viscosity of 3,000 to 6,000 cP and a 15 to 25 minute gel time for a 250 g mass. Application methods include trickle and brush-on processing for motor and transformer windings, high-speed armatures, and protective overcoating.
Key features
- Low-Temperature Trickle Impregnation: The system is used for trickle application into motor and transformer windings.
- 15 to 25 Minute Gel Time: This typical range applies to a 250 g mixed mass at 25 deg C.
- 1,700 Volts/Mil Dielectric Strength: Typical cured properties also include 1.1 x 10^15 ohm-cm volume resistivity.
Applications
Motor and transformer winding impregnation; high-speed armatures; protective overcoating of motor windings; appliance motors.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical E230 resin, C230 hardener, and mixed-system values from the exact ELANTAS TDS.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin viscosity | 10,000 to 15,000 | cP | E230 resin; 25 deg C |
| Hardener viscosity | 100 to 500 | cP | C230 hardener; 25 deg C |
| Resin weight per gallon | 9.5 to 9.9 | lb | E230 resin; 25 deg C |
| Hardener weight per gallon | 8.4 to 8.8 | lb | C230 hardener; 25 deg C |
| Mix ratio | 100:20 | parts by weight | E230 resin:C230 hardener |
| Mix ratio | 100:22.6 | parts by volume | E230 resin:C230 hardener |
| Mixed viscosity | 3,000 to 6,000 | cP | 25 deg C |
| Gel time | 15 to 25 | minutes | 250 g mixed mass at 25 deg C |
After-processing / final-state properties
Typical cured-system values; process and cure conditions must be selected from the exact TDS for the intended unit and application.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Helical-coil bond strength | 40 | lb | At 25 deg C; ASTM D2519 over MW 35 |
| Helical-coil bond strength | 4 | lb | At 150 deg C; ASTM D2519 over MW 35 |
| Hardness | Shore D 75 to 85 | - | Typical cured-system value |
| Water absorption | 0.2 | % | 24 hours at 25 deg C |
| Dielectric strength | 1,700 | volts/mil | 25 deg C; 3 mils; ASTM D149 |
| Volume resistivity | 1.1 x 10^15 | ohm-cm | 25 deg C; ASTM D257 |
| Dielectric constant | 3.8 | - | 1 kHz at 25 deg C |
| Dissipation factor | 0.03 | - | 1 kHz at 25 deg C |
