DOWSIL TC-6011

Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other

DOWSIL TC-6011

Main features

  • 135-Minute Pot Life
  • 1.0 W/(m K) Thermal Conductivity
  • 21 kV/mm Dielectric Strength

Product Description

DOWSIL TC-6011 Thermally Conductive Encapsulant is a two-part, gray thermally conductive silicone encapsulant for LED lamps and luminaires, LED drivers, and power supplies requiring potting and heat transfer. Parts A and B mix 1:1 by weight, and the flowable material has a typical mixed viscosity of 3,000 mPa s with a 135-minute pot life at room temperature. It can cure at room temperature or by heat, with typical heat-cure options of 120 minutes at 60 deg C, 60 minutes at 80 deg C, or 40 minutes at 100 deg C. After cure, typical properties include 1.0 W/(m K) thermal conductivity, Shore A 28 hardness, 21 kV/mm dielectric strength, and 70% elongation.

Key features

  • About 3000 mPa s Mixed Viscosity: Typical mixed viscosity characterizes the two-part encapsulant before cure.
  • 40-Minute Cure at 100 deg C: Alternative heat-cure schedules include 60 minutes at 80 deg C or 120 minutes at 60 deg C.
  • 1.0 W/(m K) Thermal Conductivity: The cured encapsulant also has typical dielectric strength of 21 kV/mm.
Product Family

DOWSIL TC-6011

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Gray
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (A/B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
135 minutes
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.65
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
70 %
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.00 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
21 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
5.30E+14 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Mix ratio1:1by weightParts A:B; typical
Viscosity - Part A3,200mPa sTypical
Viscosity - Part B2,400mPa sTypical
Viscosity - mixed3,000mPa sTypical
Pot life135minRoom temperature; typical
Heat cure schedule120 / 60 / 40minAt 60 / 80 / 100 deg C respectively; typical
Shelf life9monthsTypical
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
Durometer28Shore ACured; typical
Thermal conductivity1.00W/(m K)Cured; typical
Adhesion to aluminum85psiCured; typical
Adhesion to FR-475psiCured; typical
Elongation70%Cured; typical
Dielectric strength21kV/mmCured; typical
Volume resistivity5.30E+14ohm*cmCured; typical

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