DOWSIL TC-4605

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DOWSIL TC-4605

Main features

  • 1:1 Equal-Weight Mixing
  • 1.0 W/(m K) Thermal Conductivity
  • 135-Minute Pot Life

Product Description

DOWSIL TC-4605 Thermally Conductive Encapsulant is a two-part, gray thermally conductive silicone encapsulant for PCB potting and electronic assemblies. Parts A and B mix 1:1 by weight, and the flowable material has a typical mixed viscosity of 2,900 mPa s with a 135-minute pot life at room temperature for manual or automated needle dispensing. It can cure at room temperature or with heat, with a typical heat cure of 1 hour at 120 deg C. After cure, typical properties include 1.0 W/(m K) thermal conductivity, Shore A 30 hardness, 21 kV/mm dielectric strength, and 100% elongation. Applications include on-board chargers, inverters, converters, transformers, and automotive electronics.

Key features

  • 1:1 Two-Part Mixing: Typical mixed viscosity is about 2,900 mPa s.
  • 1.0 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured encapsulant.
  • 21 kV/mm Dielectric Strength: Typical electrical-insulation value applies to the cured material.
Product Family

DOWSIL TC-4605

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Gray
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two-Part (A | B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
135 hours
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.67
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
100 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
21 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.30E+14 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.00 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Mix ratio1:1by weightParts A:B; typical
Viscosity - Part A3,100mPa sTypical
Viscosity - Part B2,500mPa sTypical
Viscosity - mixed2,900mPa sTypical
Pot life135minRoom temperature; typical
Heat cure1hAt 120 deg C; typical
Shelf life9monthsTypical
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
Durometer30Shore ACured; typical
Thermal conductivity1.00W/(m K)Cured; typical
Tensile strength110psiCured; typical
Elongation100%Cured; typical
Volume resistivity3.30E+14ohm*cmCured; typical
Dielectric strength21kV/mmCured; typical

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