DOWSIL TC-4025

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

DOWSIL TC-4025

Main features

  • Self-Leveling Dispensable Pad
  • Approximately 2.5 W/(m K) Thermal Conductivity
  • 30-Minute Cure at 125 deg C

Product Description

DOWSIL TC-4025 Dispensable Thermal Pad Kit is a two-part, blue, thermally conductive dispensable pad kit for thermal gap filling in electronic assemblies. The mixed material has a typical viscosity of 119,000 cP and is designed for dispensing with self-leveling behavior. It cures in about 24 hours at 25 deg C or 30 minutes at 125 deg C and reaches a typical Shore 00 hardness of 61. Thermal conductivity is about 2.5 W/(m K), with the cured material remaining soft and reworkable. Applications include heat dissipation in electronic control units, advanced driver assistance systems, power electronics, telecom devices, lamps, and luminaires.

Key features

  • About Shore 00 61 Cured Hardness: Typical hardness characterizes the final dispensable thermal-pad material.
  • About 2.5 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies after cure.
  • 24-Hour Cure at 25 deg C: A 30-minute heat cure at 125 deg C is also listed.

Applications

Electronic control units; advanced driver assistance systems; power electronics; telecom devices; lamps and luminaires.

Product Family

DOWSIL TC-4025

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (A/B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
5 hours
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.81
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
66 %
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
2.51 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
15.4 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
8.84E13 Ohms⋅cm

Additional Information

Technical properties

As-supplied component properties

PropertyValueUnitMethod / condition
Viscosity, Part A126,000cPTypical
Viscosity, Part B127,000cPTypical
Viscosity, mixed119,000cPTypical
Technical properties

Cured thermal pad properties

PropertyValueUnitMethod / condition
Specific gravity2.81g/cm^3Cured; typical
Hardness61Shore 00Cured; typical
Thermal conductivity2.51W/(m K)Typical
Dielectric strength15.4kV/mmTypical
Volume resistivity8.84E13ohm*cmTypical

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