DOWSIL TC-4015

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

DOWSIL TC-4015

Main features

  • 1.7 W/(m K) Thermal Conductivity
  • 4-Hour Working Time at 25 deg C
  • Screen-Printed or Dispensed Gap Filling

Product Description

DOWSIL TC-4015 Dispensable Thermal Pad is a two-part thermally conductive dispensable pad for filling thermal gaps in electronic assemblies. Parts A and B are white and blue pastes that mix to a material with a typical viscosity of 103,000 cP. The system has a typical 4-hour working time at 25 deg C and cures in 24 hours at 25 deg C, with heat acceleration to 10 minutes at 125 deg C. After cure, thermal conductivity is typically 1.7 W/(m K) and Shore 00 hardness is 50. It can be screen printed or dispensed into varied thicknesses and shapes for cooling PCB assemblies in LED, automotive, and consumer applications.

Key features

  • About 1.7 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured dispensable pad.
  • About 4-Hour Pot Life: Typical pot life applies to the mixed two-part material before cure.
  • 24-Hour Cure at 25 deg C: Room-temperature cure can be accelerated with heat.

Applications

Cooling PCB assemblies in LED lamps and luminaires; automotive electronics; consumer electronics.

Product Family

DOWSIL TC-4015

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (A/B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
4 hours
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.6
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
260 %
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.7 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
18 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
5.18E+12 Ohms⋅cm

Additional Information

Technical properties

As-supplied component properties

PropertyValueUnitMethod / condition
Viscosity, Part A104,000cPTypical
Viscosity, Part B124,000cPTypical
Viscosity, mixed103,000cPTypical
Technical properties

Cured thermal pad properties

PropertyValueUnitMethod / condition
Specific gravity2.6-Cured; typical
Hardness50Shore 00Cured; typical
Thermal conductivity1.7W/(m K)Typical
Dielectric strength18kV/mmTypical
Volume resistivity5.18E12ohm*cmTypical

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