DOWSIL SE 4490 CV

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

DOWSIL SE4490

Main features

  • Non-Curing Thermal Interface
  • 1.9 W/(m K) Thermal Conductivity
  • 520,000 cP Viscosity

Product Description

DOWSIL SE 4490 CV Thermally Conductive Compound is a one-part, white, non-curing, non-flowing silicone thermal compound for transferring heat from electronic components to heat sinks or chassis. The formulation uses a siloxane polymer matrix with thermally conductive fillers and has a typical thermal conductivity of 1.9 W/(m K). Its 520,000 cP viscosity and non-flowing consistency support controlled placement by manual or automated dispensing, while controlled silicone volatility is part of the product design. Applications include cooling automotive control modules, power supplies, and display driver ICs. Because the material does not cure, it remains a dispensable thermal interface rather than forming a cured elastomer.

Key features

  • No-Cure Thermal Interface: One-part compound remains non-curing and is installed without a cure step.
  • 1.9 W/(m K) Thermal Conductivity: Typical bulk thermal-conductivity value applies to the non-curing compound.
  • 520,000 cP Viscosity: Typical as-supplied viscosity characterizes the non-flowing compound.

Applications

Automotive control modules; power supplies; display driver ICs.

Product Family

DOWSIL SE 4490 CV

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
White
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.63
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
2.3
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
520000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.9 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2E+14 Ohms⋅cm

Additional Information

Technical properties

As-supplied properties

PropertyValueUnitMethod / condition
Viscosity520,000cPTypical
Specific gravity2.63-Uncured; typical
Nonvolatile content99.96%Typical
Technical properties

In-use properties

This material does not cure and remains a non-curing thermal compound in service.

PropertyValueUnitMethod / condition
Thermal conductivity1.9W/(m K)Typical
Thermal resistance0.77deg C cm^2/WAt 40 psi; typical
Volume resistivity2E14ohm*cmTypical

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