ALPHA EF-2100
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 4.0 wt% Solids Content
- ORL0 No-Clean Flux
- Lead-Free Hole-Fill Performance
Product Description
ALPHA EF-2100 is a VOC-free, halide-free, rosin/resin-free, low-solids no-clean liquid flux for wave soldering and through-hole assembly. Its 4.0 wt% solids formulation is classified ORL0 under IPC J-STD-004 and has less than 1% VOC content. Typical processing uses 95 to 115 deg C top-side preheat and 2 to 7 seconds of solder contact time. In lead-free assemblies, it provides good hole fill with low solder balling and bridging and leaves an evenly spread, tack-free residue.
Key features
- 4.0 wt% low-solids formulation: The 4.0 wt% solids level is paired with less than 1% VOC content in the as-supplied liquid flux.
- Lead-free hole-fill performance: The flux provides good hole fill with low solder balling and bridging in lead-free assemblies.
- IPC flux classification: J-STD-004 designation is ORL0 for the halide-free, rosin/resin-free no-clean formulation.
Applications
Wave soldering and through-hole assembly for lead-free soldering, including applications requiring good hole fill and low solder balling or bridging.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Additional Information
As supplied
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Solids content | 4.0 | wt% | Typical |
| Specific gravity | 1.015 +/- 0.003 | Typical at 25 deg C | |
| pH | 2.2 | Typical; as is | |
| Acid number | 31.5 +/- 2.0 | mg KOH/g | Typical |
| VOC content | <1 | % | Typical |
| Shelf life | 18 | months | Typical |
| IPC J-STD-004 designation | ORL0 | As supplied |
