ABLESTIK 958
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Conductive And Non-Conductive Variants
- Stress-Absorbing Die-Attach Options
- 958-7 17 N/mm^2 Gold Lap Shear
Product Description
LOCTITE ABLESTIK 958 Series is a heat-cure epoxy die-attach series represented by suffix grades 958-2, 958-7, and 958-11. The 958-2 and 958-7 variants are gray, silver-filled, electrically conductive adhesives for hybrid die attach, while 958-11 is a white, non-conductive stress-absorbing adhesive for bonding large ICs. The 958-2 formulation is toughened for stress absorption, while 958-7 has 17 N/mm^2 lap shear on gold-to-gold joints in the stated test configuration. Electrical function, cure schedule, rheology, and final properties remain suffix-specific across the series.
Key features
- Electrical-function range: 958-2 and 958-7 are silver-filled conductive variants, while 958-11 is non-conductive.
- Stress-management variants: 958-2 is toughened for stress absorption, and 958-11 is intended to absorb stresses when bonding large ICs.
- Gold-substrate shear: 958-7 has 17 N/mm^2 lap shear on gold-to-gold joints in the stated test configuration.
Applications
Hybrid die attach with 958-2 and 958-7, and large-IC die attach with 958-11.
