ABLESTIK 789-4

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK 789-4

Main features

  • 0.7 W/(m K) Thermal Conductivity
  • 91-Day Work Life at 25 deg C
  • 30-Minute 150 deg C Cure

Product Description

LOCTITE ABLESTIK 789-4 is a one-component white heat-cure epoxy paste for thermally conductive substrate attach, microelectronic package sealing, heat sink attach, and component attach on gold, silver, and copper finishes. Typical cured thermal conductivity is 0.7 W/(m K) at 121 deg C, with volume resistivity of 6 x 10^14 ohm cm and a glass transition temperature of 130 deg C. Aluminum-to-aluminum lap-shear strength is at least 2,600 psi at 25 deg C. The paste has a typical 91-day work life at 25 deg C, with recommended cure schedules of 30 minutes at 150 deg C or 1 hour at 125 deg C.

Key features

  • Thermal conductivity: The typical cured value is 0.7 W/(m K) at 121 deg C.
  • Electrical insulation: Cured volume resistivity is typically 6 x 10^14 ohm cm, with 600 V/mil dielectric strength.
  • Metal-interface shear: Lap shear at 25 deg C is at least 2,600 psi for aluminum-to-aluminum and 4,000 psi for gold-to-gold.

Applications

Substrate attach, sealing microelectronic packages, heat sink attach, and component attach.

Product Family

ABLESTIK 789-4

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
White paste
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
23.6 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
6×10¹⁴ Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
130 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.7 W/m.K

Additional Information

Technical properties

As supplied

PropertyValueUnitMethod / condition
AppearanceWhite pasteAs supplied
Work life91days25 deg C
Shelf life at 5 deg C183daysAs supplied
Shelf life at -40 deg C365daysAs supplied
Technical properties

Cured material

PropertyValueUnitMethod / condition
Glass transition temperature (Tg)130deg CTypical cured material
Thermal conductivity0.7W/(m K)121 deg C
Hardness90Shore DTypical cured material
Volume resistivity6 x 10^14ohm cmTypical cured material
Dielectric strength600V/milTypical cured material
Lap shear strength17.93N/mm^2Aluminum to aluminum; 25 deg C
Lap shear strength27.59N/mm^2Gold to gold; 25 deg C

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