ABLESTIK 517

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK 517-4-007/009

Main features

  • Tack-Free Non-Conductive Film
  • 24-Hour Work Life at 25 deg C
  • 30-Minute 150 deg C Cure

Product Description

LOCTITE ABLESTIK 517 - source configuration 517-4-007/009 is a configurable LOCTITE ABLESTIK 517 tack-free, non-conductive, heat-cure epoxy film adhesive offered as sheet stock or die-cut preforms to customer drawings. The 517 material provides 24 hours of work life by consistency at 25 deg C and 365 days of shelf life at -40 deg C. Recommended cure is 30 minutes at 150 deg C, with alternate schedules of 1 hour at 125 deg C, 2 hours at 95 deg C, or 3 hours at 75 deg C. It is used in microelectronic assembly, including mounting substrates into ceramic packages, and is not recommended for gold-plated packages.

Key features

  • Tack-free non-conductive film: The 517 epoxy film is tack-free and electrically non-conductive.
  • 24-hour work life: Work life by consistency is 24 hours at 25 deg C.
  • Multi-temperature heat cure: Recommended cure is 30 minutes at 150 deg C, with alternate schedules down to 3 hours at 75 deg C.

Applications

Microelectronic assembly, including mounting substrates into ceramic packages.

Product Family

ABLESTIK 517

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Pink
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
0.0762 mm
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
101 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.28 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
39.4 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.5×10¹³ Ohms⋅cm

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