ABLESTIK 2600BT

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK 2600BT

Main features

  • 20 W/(m K) Thermal Conductivity
  • 0.001 ohm-cm Volume Resistivity
  • 40 ppm/deg C CTE Below Tg

Product Description

LOCTITE ABLESTIK 2600BT is a silver-filled, single-paste die-attach adhesive that heat cures to form a thermally and electrically conductive attachment layer for high-power and discrete semiconductor devices. Optimal storage temperature for the uncured paste is -40 deg C. After heat cure, typical thermal conductivity is 20 W/(m K), and typical volume resistivity is 0.001 ohm-cm. The cured coefficient of thermal expansion is typically 40 ppm/deg C below the glass transition temperature and 70 ppm/deg C above it.

Key features

  • 20 W/(m K) thermal conductivity: The typical value applies to the cured silver-filled die-attach material.
  • 0.001 ohm-cm volume resistivity: This typical cured-material electrical property characterizes the conductive attachment layer.
  • Temperature-dependent thermal expansion: Typical CTE is 40 ppm/deg C below the glass transition temperature and 70 ppm/deg C above it.

Applications

High-power devices; discrete devices; die attach.

Product Family

ABLESTIK 2600BT

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
≥3.5
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
7,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
41 °C
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.001 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
FormSingle paste-Heat-cure die-attach adhesive
FillerSilver-Thermally and electrically conductive paste
Optimal storage temperature-40deg CAs supplied
Technical properties

After-processing / final-state properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
Thermal conductivity20W/(m K)Cured material
Volume resistivity0.001ohm-cmCured material
CTE below Tg40ppm/deg CCured material
CTE above Tg70ppm/deg CCured material

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