ABLESTIK 2130

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ABLESTIK 2130

Main features

  • 20-Minute Pot Life
  • 12,000 mPa s Mixed Viscosity
  • 420 V/mil Dielectric Strength

Product Description

LOCTITE ABLESTIK 2130 is a clear, transparent, solvent-free two-part epoxy adhesive for rigid laminating, sealing, and electrically insulating bonds. Resin and hardener mix 100:25 by weight; typical mixed viscosity is 12,000 mPa s at 25 deg C. Pot life is 20 minutes. Guideline cure schedules are 24 hours at 25 deg C or four hours at 65 deg C. Typical cured properties include Shore D hardness 87, 420 V/mil dielectric strength, and a linear thermal-expansion coefficient of 52 ppm/deg C. The cured operating range is -60 to 125 deg C.

Key features

  • 12,000 mPa s mixed viscosity: This typical value applies at 25 deg C after mixing resin and hardener 100:25 by weight.
  • Cured electrical properties: Typical dielectric strength is 420 V/mil; volume resistivity at 25 deg C is 6 x 10^13 ohm-cm.
  • 52 ppm/deg C linear thermal expansion: The typical coefficient applies to the cured epoxy, which has Shore D hardness 87.

Applications

Rigid laminating; sealing; bonding ceramics, glass, glass fabrics, metals, plastic laminates, wood, and most rigid plastics.

Product Family

ABLESTIK 2130

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Clear, transparent
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two (Resin | Hardener)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
20 minutes
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.21
Thermal Properties
Operating Temperature
-60 to 125 °C
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
1.0
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
16.5 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
6×10¹³ Ohms⋅cm
Other Properties
Storage Temperature
≤27 °C °C

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
TechnologyTwo-part epoxy-Non-conductive adhesive
AppearanceClear, transparent-Mixed material
Mix ratio by weight100:25resin:hardenerTwo-component system
Mixed viscosity12,000mPa s25 deg C
Thixotropic index1.0-Mixed material
Specific gravity1.21-Mixed material
Pot life20minMixed material
Cure schedule24 h at 25 deg C or 4 h at 65 deg C-Guideline schedule
Technical properties

After-processing / final-state properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
Operating temperature-60 to 125deg CCured adhesive
Shore D hardness87-Cured material
Coefficient of linear thermal expansion52ppm/deg CCured material
Izod impact strength0.2ft-lb/inNotched specimen
Reactive solids content100%Cured system
Dielectric strength420V/milCured material
Volume resistivity6 x 10^13ohm-cm25 deg C
NASA outgassingPass-Cured material

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