ABLESTIK 2126

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ABLESTIK 2126

Main features

  • 30-Minute Pot Life
  • 40,000 mPa s Mixed Viscosity
  • -50 to 145 deg C Operation

Product Description

LOCTITE ABLESTIK 2126 BIPAX is a black, opaque, thixotropic two-part epoxy adhesive supplied in BIPAX packaging for electrically insulating bonding and laminating. The solvent-free resin and hardener mix 100:12 by weight, giving a typical mixed viscosity of 40,000 mPa s at 25 deg C. Pot life is 30 minutes. Guideline curing is 24 hours at 25 deg C, or four hours at 25 deg C followed by four hours at 65 deg C. Typical cured properties include 390 V/mil dielectric strength, Shore D hardness 90, and a linear thermal-expansion coefficient of 33 ppm/deg C. The operating-temperature range is -50 to 145 deg C.

Key features

  • Thixotropic mixed paste: The resin and hardener mix 100:12 by weight, producing typical mixed viscosity of 40,000 mPa s at 25 deg C.
  • Cured dielectric performance: Typical dielectric strength is 390 V/mil; volume resistivity at 25 deg C is 3.80 x 10^16 ohm-cm.
  • 33 ppm/deg C linear thermal expansion: This typical cured-material coefficient accompanies a glass transition temperature of 95 deg C.

Applications

Photographic applications; industrial bonding; laminating.

Product Family

ABLESTIK 2126

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two (Resin | Hardener)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
30 minutes
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.6
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
95.0 °C
Operating Temperature
-50 to 145 °C
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
15.35 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.80×10¹⁶ Ohms⋅cm
Other Properties
Storage Temperature
≤27 °C °C

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
TechnologyTwo-part epoxy-Non-conductive adhesive
AppearanceBlack opaque paste-Mixed material
Mix ratio by weight100:12resin:hardenerBIPAX package
Mixed viscosity40,000mPa s25 deg C
Specific gravity1.6-Mixed material
Pot life30minMixed material
Cure schedule24 h at 25 deg C or 4 h at 25 deg C plus 4 h at 65 deg C-Guideline schedule
Technical properties

After-processing / final-state properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
Operating temperature-50 to 145deg CCured adhesive
Shore D hardness90-Cured material
Glass transition temperature95deg CCured material
Coefficient of linear thermal expansion33ppm/deg CCured material
Heat distortion temperature102deg CCured material
Dielectric strength390V/milCured material
Volume resistivity3.80 x 10^16ohm-cm25 deg C
Aluminum lap shear19N/mm22 h cure at 65 deg C

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